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2Gb: x16, x32 Mobile LPDDR2 SDRAM S4
Features
Mobile LPDDR2 SDRAM
MT42L128M16D1, MT42L64M32D1, MT42L64M64D2,
MT42L128M32D2, MT42L256M32D4, MT42L128M64D4
MT42L96M64D3, MT42L192M32D3
Features
? Ultra low-voltage core and I/O power supplies
– V DD2 = 1.14–1.30V
– V DDCA /V DDQ = 1.14–1.30V
– V DD1 = 1.70–1.95V
? Clock frequency range
– 533–10 MHz (data rate range: 1066–20 Mb/s/pin)
? Four-bit prefetch DDR architecture
? Eight internal banks for concurrent operation
? Multiplexed, double data rate, command/address
inputs; commands entered on every CK edge
? Bidirectional/differential data strobe per byte of
data (DQS/DQS#)
? Programmable READ and WRITE latencies (RL/WL)
? Programmable burst lengths: 4, 8, or 16
? Per-bank refresh for concurrent operation
? On-chip temperature sensor to control self refresh
rate
? Partial-array self refresh (PASR)
? Deep power-down mode (DPD)
? Selectable output drive strength (DS)
? Clock stop capability
? RoHS-compliant, “green” packaging
Table 1: Key Timing Parameters
Options
? V DD2 : 1.2V
? Configuration
– 16 Meg x 16 x 8 banks x 1 die
– 8 Meg x 32 x 8 banks x 1 die
– 8 Meg x 32 x 8 banks x 2 die
– 16 Meg x 16 x 8 banks x 4 die
– 8 Meg x 32 x 8 banks x 2 die
– 8 Meg x 32 x 8 banks x 3 die
– 8 Meg x 32 x 8 banks x 4 die
– 16 Meg x 16 x 8 banks x 2 die +
8 Meg x 32 x 8 banks x 1 die
? Device type
– LPDDR2-S4, 1 die in package
– LPDDR2-S4, 2 die in package
– LPDDR2-S4, 3 die in package
– LPDDR2-S4, 4 die in package
? FBGA“green” package
– 134-ball FBGA (11mm x 11.5mm)
– 134-ball FBGA (11.5mm x 11.5mm)
– 168-ball FBGA (12mm x 12mm)
– 168-ball FBGA (12mm x 12mm)
– 168-ball FBGA (12mm x 12mm)
– 216-ball FBGA (12mm x 12mm)
– 216-ball FBGA (12mm x 12mm)
– 216-ball FBGA (12mm x 12mm)
Marking
L
128M16
64M32
128M32
256M32
64M64
96M64
128M64
192M32
D1
D2
D3
D4
MH
MG
KL
LE
KP
KH
KJ
KU
Speed
Grade
Clock
Rate
(MHz)
Data Rate
(Mb/s/pin) RL WL
t RCD/ t RP 1
– 220-ball FBGA (14mm x 14mm)
– 220-ball FBGA (14mm x 14mm)
? Timing – cycle time
– 1.875ns @ RL = 8
MP
LD
-18 2
-18 2
-25
-3
533
400
333
1066
800
667
8
6
5
4
3
2
Typical
Typical
Typical
– 2.5ns @ RL = 6
– 3.0ns @ RL = 5
? Operating temperature range
– From –25°C to +85°C
-25
-3
IT
– From –40°C to +105°C
? Revision
AT
:A
Notes:
1. For fast t RCD/ t RP, contact factory.
2. For -18 speed grade, contact factory.
PDF: 09005aef83f3f2eb
2gb_mobile_lpddr2_s4_g69a.pdf – Rev. N 3/12 EN
1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2010 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
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